It's unavoidable - mention HP and images of the TouchPad come floating to the surface. What most geek folk don't realize, however, is that the company recently famous for open sourcing webOS has been hard at work behind-the-scenes prepping for the next stage in computing: integrated photonics. The project, codenamed Corona, aims to create stackable 3D chips that communicate using inbuilt, microscopic lasers made from gallium. This new breed of CPUs is on track to combine "256 general purpose cores organized in 64 four-core clusters" created using a 16nm process for a performance boost of up to six times faster than traditional circuitry.
Engadget, HP eyes 2015 release for 3D integrated photonic chips
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